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精细化工 -- 锡电镀前处理药水 -- 电解去溢料
  • 品名: 电解去溢料
  • 编号: BST9241
  • 产品简介: 负责用电解的方法将其软化和脱离机体,后面再用高压水刀就打掉了。
  • 产品规格: 25L/桶
  • 产品优势: 去溢料是在半导体工业和电子工业中塑封工序之后的一道工序。通常这一工序广泛

    应用易燃性溶液,需要100~110℃高温煮,容易引起塑封体离层等问题,影响电子元器件的可靠性。经过不断的研究和发展,我们克服了在市场上的其他一些去溢料溶液的缺点。根据客户的不同情况,我们提供在50~80℃水煮下去除各种Flashes和Resin Bleed的方案

    Deflashing is a process following plastic package in semiconductor industry and electronics industry. Generally this process extensively uses flammable solution which needs to be boiled under 100-110℃ high temperature. This will easily lead to the peeling off of the sealed parts and impair the reliability of electronic components. After ceaseless efforts, we have perfected the deflashing solutions of the market. We will offer customers tailored solutions to removing various flashes and resin bleed under 50- 80℃ boiled temperature.