清模胶条：是一种用来清洗模具的橡胶，适用于清洗半导体封装模具，去除环氧树脂塑封料在封装过程中型腔内形成的污渍 。

 Cleaning rubber sheet:It is used to remove epoxy stains formed during packaging in the cavity or surface of mold.

在塑封过程中，清模是重要工序。塑封料以及脱模剂的部分成分在高温的作用下氧化，附着在模具表面形成难除污垢。若不及时清除，会造成封装时离型困难个封装体外观缺陷，且模腔表面会受损。

In Molding pricess,some components of molding compound and releasing agent are oxidated and attached to the mold surface in high temperature,and make the residue difficult to remove.If not remove in time,not only cause the diffculties of mold release and the defects of package appearance,but also damage the surface of the die cavity.

1.无须使用引线框架 Not use the lead frame

2.节省清洁时间 Save the time of cleaning

3.无须固话&预热 No Curing & preheat

4.不损坏模具表面 Not damage the surface of mold

5.操作简单 Easy operation