我们提供粘片设备使用的橡胶吸嘴，设计综合考虑了橡胶材料的特性以及半导体行业运用吸嘴在生产工艺中的性能要求，以满足客户对吸嘴的耐温性、耐磨损性、膨胀系数的要求及改善吸嘴在使用过程中的回吸问题.

We provide rubber tips for die bonder, the design of which considers the rubber material characteristics and the performance requirements for the tips in the production process of semiconductor industry, to meet customer requirements for the temperature resistance, abrasion resistance, and expansion coefficient pf the tips and to improve the back suction problems of the tips in  use.